6804 2100 40
6804210040
Steel wire used for cropping and squaring semiconductors: -coated with diamond grains of 5µm or more, but not more than 55µm -wire diameter 23 µm or more but not more than 350 µm, -having a breaking strength of 11 N or more, but not more than 170 N
- Reference date
- 2026-10-11
- Last TARIC file date
- 2026-10-08
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